How many degrees of disassembly FPGA chip

March 10, 2024
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How many degrees of disassembly FPGA chip

The FPGA chip is currently a widely used programmable logic device in the electronics industry.It consists of a large number of programmable logic units and programmable interconnection resources.Because of its high plasticity and programming, it is widely used in the fields of embedded systems, communication systems, digital images, high -speed devices and other fields.However, because the FPGA chip is encapsulated in plastic packaging or metal packaging, the packaging itself is a high -strength material that needs to be obtained by unpacking to obtain the chip.So, how do we use the most scientific way to unlock the FPGA chip, this article will interpret it in detail from different angles.

1. The verification before the sealing

Before FPGA sealing, the PCB and BGA stickers of the circuit board are required to detect the inspection of the circuit board.The use of microscope inspections is extremely high in accuracy of the test results, including area, copper coating, padding size, and the appearance of the needle.

Virtex-7 FPGA

2. Determine the suitable temperature

Put the FPGA chip into a proper heating environment and use the hot plate or heat source for heating. The temperature in it should not be too high and low, generally about 120 degrees Celsius.If it is too high to burn the chip, too low may cause the chip to be warped when deleting, which affects the Z axis deletion.

3. Determine the suitable combustion temperature

During the heating of the FPGA chip, we need to use a chemical agent for combustion. Generally, ammonium boric acid or sulfuric acid is selected for combustion treatment.It is necessary to be very careful that the temperature of the combustion process should not be too high, otherwise it may affect the quality of the chip.

4. Observe the combustion condition

Observe the overall state of the burning material. If there are black spots or cracks, the combustion can be stopped.At this time, chemical agents need to be cleaned. It is recommended to use chemical agents and sodium hydroxide.


5. Delete pad

Disassemble the pad part with a blade.However, it should be noted that once the part is scratched, it will not be repaired.

6. Delete copper coating

Use a chemical agent to help remove the copper coating on the surface of the chip.The difficulty here is to remove the copper coating as much as possible without changing the chip structure.

7. Delete SIO2

The surface of the FPGA chip is also covered with a layer of SIO2. This layer not only interrupted the node, but also can be used as a substrate for VCC or ground.Finally, use a chemical agent to peel the SIO2 layer and wash and wash in order.


8. Delete Si

The last step is to be completely deleted.


Through the above introduction, we can draw a conclusion: dismantling the FPGA chip is not easy, and we need to have scientific and accurate operating skills and rigorous attitudes.Starting from the detection of the circuit board, to the control of the heating temperature, to deleting the layers of pads, copper coating, SIO2, SI, etc., each step needs to be carefully operated.Therefore, in actual disassembly operations, be sure to be cautious and accurate operations, increase the success rate of disassembly, and reduce the risk of damage to ensure the success of the operation.