Description
Series: SmartFusion®2
Package: Tray
Product Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA – 90K Logic Modules
Operating Temperature: -40°C ~ 125°C (TJ)
Grade: Automotive
Qualification: AEC-Q100
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27×27)







