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TDA4AL88TGAALZRQ1

Texas Instruments
Available in stock .

AUTOMOTIVE SYSTEM-ON-A-CHIP FOR

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Description

Series: –

Package: Tape & Reel (TR)Cut Tape (CT)Digi-Reel®

Product Status: Active

Architecture: DSP, MCU, MPU

Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

Flash Size: –

RAM Size: 1.5MB

Peripherals: DMA, PWM, WDT

Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB

Speed: 2GHz, 1GHz, 1GHz

Primary Attributes: –

Operating Temperature: -40°C ~ 125°C (TJ)

Grade: Automotive

Qualification: AEC-Q100

Package / Case: 770-BFBGA, FCBGA

Supplier Device Package: 770-FCBGA (23×23)

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