Description
| Categories | Integrated Circuits |
| Manufacturer | Xilinx Inc. |
| Status | Active |
| Number of LABs/CLBs | 600 |
| Number of Logic Elements/Cells | 2700 |
| Total RAM Bits | 40960 |
| Number of I/O | 176 |
| Number of Gates | 100000 |
| Supply Voltage – Operating | 2.375 V to 2.625 V |
| Mounting | SMD (SMT) |
| Temperature Range – Operating | 0°C to 85°C (TJ) |
| Case / Package | 256-FBGA (17×17) |
| Family Name | XC2S100 |
| Introduction Date | 36831 |
| ECCN | EAR99 |
| Country of Origin | Philippines, Republic of Korea, Taiwan |
| Estimated EOL Date | 2022 |
| Is this a common-used part? | Yes |
| Popularity | High |
| Fake Threat In the Open Market | 40 pct. |
| Supply and Demand Status | Limited |
| Alternative Parts | APA600-1FGG256I; APA600-1FGG256; APA300-1FG256; |
| (Cross-Reference) |
