Description
Categories | Integrated Circuits |
Manufacturer | Xilinx Inc. |
Status | Active |
Number of LABs/CLBs | 600 |
Number of Logic Elements/Cells | 2700 |
Total RAM Bits | 40960 |
Number of I/O | 176 |
Number of Gates | 100000 |
Supply Voltage – Operating | 2.375 V to 2.625 V |
Mounting | SMD (SMT) |
Temperature Range – Operating | 0°C to 85°C (TJ) |
Case / Package | 256-FBGA (17×17) |
Family Name | XC2S100 |
Introduction Date | 36831 |
ECCN | EAR99 |
Country of Origin | Philippines, Republic of Korea, Taiwan |
Estimated EOL Date | 2022 |
Is this a common-used part? | Yes |
Popularity | High |
Fake Threat In the Open Market | 40 pct. |
Supply and Demand Status | Limited |
Alternative Parts | APA600-1FGG256I; APA600-1FGG256; APA300-1FG256; |
(Cross-Reference) |