Description
| Categories | Integrated Circuits |
| Manufacturer | Xilinx Inc. |
| Status | Active |
| Number of LABs/CLBs | 448 |
| Number of Logic Elements/Cells | 4032 |
| Total RAM Bits | 294912 |
| Number of I/O | 195 |
| Number of Gates | 200000 |
| Supply Voltage – Operating | 1.14 V to 1.26 V |
| Mounting | SMD (SMT) |
| Temperature Range – Operating | -40°C to 100°C (TJ) |
| Case / Package | 256-FTBGA (17×17) |
| Family Name | XC3S200AN |
| Introduction Date | 39119 |
| ECCN | EAR99 |
| Country of Origin | Philippines, Republic of Korea, Singapore, Taiwan |
| Halogen Free | Compliant |
| Estimated EOL Date | 2022 |
| Is this a common-used part? | Yes |
| Popularity | High |
| Fake Threat In the Open Market | 70 pct. |
| Supply and Demand Status | Limited |
| Alternative Parts | A3P1000-FFG256; A3PE600-FG256ES; A3P1000-FFGG256; |
| (Cross-Reference) |
