Description
| Manufacturer | Xilinx Inc. |
| Packaging | Tray |
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 348 |
| Supply Voltage (V) | 1.14V ~ 1.26V |
| Mounting Style | SMD |
| Temperature Range – Operating | -40°C ~ 100°C |
| Manufacturer Package | 676-BGA |
| Supplier Device Package | 676-FBGA (27×27) |
| Part Number Series | XC6SLX75 |
| Manufacturer Pack Quantity | 40 |
| MSL Level | 3 (168 Hours) |
| Popularity | Low |
| Fake Threat In the Open Market | 63 pct. |
| Supply and Demand Status | Limited |
| Win Source Part Number | 812580-XC6SLX75T-3FGG676I |
