Description
| RAM Size: | 256KB |
|---|---|
| Package / Case: | 225-LFBGA, CSPBGA |
| Packaging: | Tray |
| Supplier Device Package: | 225-CSPBGA (13×13) |
| Number of I/O: | 54 |
| Speed: | 667MHz |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Detailed Description: | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 23K Logic Cells 256KB 667MHz 225-CSPBGA (13×13) |
| Flash Size: | – |
| Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Core Processor: | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Primary Attributes: | Artix™-7 FPGA, 23K Logic Cells |
| Email: | [email protected] |
| Series: | Zynq®-7000 |
| Other Names: | 122-2009 |
| Architecture: | MCU, FPGA |
| Operating Temperature: | -40°C ~ 100°C (TJ) |
| Peripherals: | DMA |
