Description
Manufacturer | Xilinx Inc. |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex -A9 MPCore with CoreSight |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Artix -7 FPGA, 28K Logic Cells |
Temperature Range – Operating | 0°C ~ 85°C |
Manufacturer Package | 225-LFBGA, CSPBGA |
Supplier Device Package | 225-CSPBGA (13×13) |
Number of I/O | 86 |
Part Number Series | XC7Z010 |
Manufacturer Pack Quantity | 160 |
MSL Level | 3 (168 Hours) |
Popularity | Medium |
Fake Threat In the Open Market | 49 pct. |
Supply and Demand Status | Balance |