Description
Category | Integrated Circuits (ICs)>Embedded – System On Chip (SoC) |
Mfr | AMD Xilinx |
Series | Zynq®-7000 |
Package | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 766MHz |
Primary Attributes | Artix™-7 FPGA, 28K Logic Cells |
Temperature Range – Operating | -40°C ~ 100°C (TJ) |
Package / Case | 225-LFBGA, CSPBGA |
Supplier Device Package | 225-CSPBGA (13×13) |
Number of I/O | 86 |
Base Product Number | XC7Z010 |
MSL Level | 3 (168 Hours) |
REACH Status | REACH Unaffected |
ECCN | 3A991A2 |
HTSUS | 8542.39.0001 |
Other Names | 122-1853 |
Standard Package | 160 |
Win Source Part Number | 1188541-XC7Z010-2CLG225I |
Fake Threat In the Open Market | 64 pct. |
Alternative Parts | XC7Z010-2CLG225I.; |