Description
Category | Integrated Circuits (ICs)>Embedded – System On Chip (SoC) |
Mfr | AMD Xilinx |
Series | Zynq®-7000 |
Package | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
Temperature Range – Operating | 0°C ~ 85°C (TJ) |
Package / Case | 484-BBGA, FCBGA |
Supplier Device Package | 484-FCBGA (23×23) |
Number of I/O | 130 |
Base Product Number | XC7Z030 |
MSL Level | 4 (72 Hours) |
REACH Status | REACH Unaffected |
ECCN | 3A991D |
HTSUS | 8542.39.0001 |
Other Names | 122-1894 |
Standard Package | 1 |
Win Source Part Number | 999420-XC7Z030-1FBG484C |
Fake Threat In the Open Market | 77 pct. |