Description
| Manufacturer | Xilinx Inc. |
| Packaging | Tray |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM Cortex -A9 MPCore with CoreSight |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex -7 FPGA, 125K Logic Cells |
| Temperature Range – Operating | -40°C ~ 100°C |
| Manufacturer Package | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27×27) |
| Number of I/O | 130 |
| Part Number Series | XC7Z030 |
| Manufacturer Pack Quantity | 1 |
| MSL Level | 4 (72 Hours) |
| Popularity | Medium |
| Fake Threat In the Open Market | 48 pct. |












