Description
Manufacturer | Xilinx Inc. |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex -A9 MPCore with CoreSight |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Kintex -7 FPGA, 125K Logic Cells |
Temperature Range – Operating | -40°C ~ 100°C |
Manufacturer Package | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27×27) |
Number of I/O | 130 |
Part Number Series | XC7Z030 |
Manufacturer Pack Quantity | 1 |
MSL Level | 4 (72 Hours) |
Popularity | Medium |
Fake Threat In the Open Market | 48 pct. |