Description
Category | Integrated Circuits (ICs)>Embedded – System On Chip (SoC) |
Mfr | AMD Xilinx |
Series | Zynq®-7000 |
Package | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
Temperature Range – Operating | 0°C ~ 85°C (TJ) |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31×31) |
Number of I/O | 130 |
Base Product Number | XC7Z045 |
MSL Level | 4 (72 Hours) |
REACH Status | REACH Unaffected |
ECCN | 3A991D |
HTSUS | 8542.39.0001 |
Other Names | 122-1900 |
Standard Package | 1 |