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Virtex UltraScale+

amd xilinx

Virtex UltraScale+ FPGA Family

Virtex™ UltraScale+™ devices are designed to provide unparalleled performance and integration capabilities in a 14nm/16nm FinFET node. The third-generation 3D ICs used in these devices utilize stacked silicon interconnect (SSI) technology to overcome the limitations of Moore’s law and offer the highest signal processing and serial I/O bandwidth to meet the most demanding design requirements. With registered inter-die routing lines enabling >600 MHz operation and abundant and flexible clocking, these devices deliver a virtual monolithic design experience.
As the most capable FPGA family in the industry, Virtex™ UltraScale+™ devices are ideally suited for compute-intensive applications such as 1+Tb/s networking, machine learning, and radar/early-warning systems. Their unmatched performance and integration capabilities make them a leading choice for designers looking to push the boundaries of what’s possible in FPGA technology.


  • Up to 128 transceivers on a device – backplane, chip-to-optics, and chip-to-chip capable
  • 150G Interlaken, 100G Ethernet MAC cores for high speed connectivity
  • DDR4 support of up to 2,666Mb/s, up to 500Mb of on-chip memory caches for increased efficiency and low latency
  • Up to 38 TOPs (22 TeraMACs) of DSP compute performance are optimized for fixed and floating point compute including INT8 for AI inference
  • FinFET with 3D IC for breakthrough density, bandwidth, and massive inter-die connectivity for virtual monolithic design
  • Gen3 x16 Integrated PCIe® block for 100G applications

What are the devices of Virtex UltraScale+ FPGA?

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