Description
Series: –
Package: Tray
Product Status: Active
Architecture: DSP, MPU
Core Processor: Dual ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
Flash Size: –
RAM Size: 2.5MB
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
Speed: 1.176GHz
Primary Attributes: –
Operating Temperature: -40°C ~ 125°C (TJ)
Grade: –
Qualification: –
Package / Case: 760-BFBGA, FCBGA
Supplier Device Package: 760-FCBGA (23×23)






