Description
Series: –
Package: Bulk
Product Status: Active
Architecture: DSP, MPU
Core Processor: ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
Flash Size: –
RAM Size: 2.5MB
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
Speed: 750MHz, 750MHz
Primary Attributes: –
Operating Temperature: -40°C ~ 125°C (TJ)
Grade: –
Qualification: –
Package / Case: 784-LFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23×23)






