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TDA3LXBBABFQ1

Texas Instruments
Available in stock .
Devices: ,
Categories:

LOW POWER SOC W/ PROCESSING, IMA

DataSheet:
    Datasheet
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Part Number # TDA3LXBBABFQ1 is available at DRex. As a leading global distributor of FPGA Chips, DRex has more than 10 years of Semiconductors Integrated Circuits(ICs) industry experience, with customers all over the world. We can quickly help customers with the most competitive price to obtain the manufacturer’s new original chip. Want to get more detailed data (specifications, lead time, quotation, shipping and payment) on TDA3LXBBABFQ1?

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Description

Series: –

Package: Tape & Reel (TR)

Product Status: Active

Architecture: DSP, MPU

Core Processor: ARM® Cortex®-M4, C66x

Flash Size: –

RAM Size: 512kB

Peripherals: DMA, POR, PWM, WDT

Connectivity: CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

Speed: 212.8MHz, 355MHz

Primary Attributes: –

Operating Temperature: -40°C ~ 125°C (TJ)

Grade: –

Qualification: –

Package / Case: 367-BFBGA, FCBGA

Supplier Device Package: 367-FCBGA (15×15)

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